3 Dimensional Integrated Circuit - 3D IC

The 3 d memory will just the first of a new generation of dense, inexpensive chips that promise to make digital recording media both cheap and convenient enough to replace the photographic film and audio tape. We can understand that 3-d ics are an attractive chip architecture, that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip. The multilayer chip building technology opens up a whole new world of design like a city skyline transformed by skyscrapers, the world of chips may never look at the same again.

Advantages Of 2-D  Ics

•     Small Size, Weight And Cost.
•     High Reliability.
•     Low Power Consumption.
•     Improved Performance.
•     Fast Operation.

Limitations

•     Functions At Fairly Low Voltage.
•     Limited  Power Dissipation.
•     Difficult To Achieve Low Noise And High Voltage Operation.
•     Poor High Frequency Performance.
•     Capacitors And Resistors Have Lower Maximum Values.

3-D  Ics

•     Vlsi Chip Used In Present Day Ic Technology.
•     Reduces Gate Delays, Increases Interconnect Delays.
•     Main Portion Of Power Used For Clk Distribution.
•     New Soc Concepts Not Compatible With 2-D Ics.
•     3-D Exploits Vertical Dimension To Nullify Interconnect Delays.
•     Heterogeneous Integration To Realize Soc
•     Here The Entire Chip Is Divided Into A Number Of Blocks.

System On A Chip (Soc)

Integration Of All Aspects Of A System Design On A Single Chip

1. Large Scale Integration Uses Global Wires—Transmission Delays,
2. Power Consumption Increases.
3.  Soc Introduces Significant Complexity In Materials And Process Integration.
4. The Noise Developed At The Interface Is Still A Major Problem.
5. Soc Designs Typically Reduce The Number Of I/O Pins Compared To A System Assembled On A Printed Circuit Board (Pcb)
6. Integration Of Mixed Technologies On A Single Die Requires Novel Design Methodologies And Tools ,With Design Productivity Being A Key Requirement.

3-D Architecture

Advantages

• The 3d Chip Design Technology Can Be Exploited To Build Socs By Placing Circuits With Different Voltage And Performance Requirements In Different Layers.

• The 3d Integration Can Reduce The Wiring, Thereby Reducing The Capacitance, Power Dissipation And Chip Area And Therefore Improve Chip Performance.

• Additionally The Digital And Analog Components In The Mixed-Signal Systems Can Be Placed On Different Si Layers Thereby Achieving Better Noise Performance Due To Lower Electromagnetic Interference Between Such Circuits Blocks.

• From An Integration Point Of View, Mixed-Technology Assimilation Could Be Made Less Complex And More Cost Effective By Fabricating Such Technologies On Separate Substractes Followed By Physical Bonding.

Applications

• Portable Electronics—Digital Cameras ,Digital Audio Players, Pdas…….

• One Of The Largest Constraints To Growth Has Been Affordable Storage, Creating The Marketing Opportunity For Ultra Low Cost Internal And External Memory.

• Device Designers Often Trade Application Richness To Meet Tight Cost Targets Of Existing Mask Rom  And Nand Flash Non Volatile Technology

Submitted By                               
                        Hashir.A
                        Roll No. 00104025
                        ECE

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